SenSys 2027
ACM Conference on Embedded Networked Sensor Systems
Networking
Cycle closed, awaiting the next call
All deadlines
AbstractMay 29, 2026est.
Paper submissionJun 5, 2026est.
From past proceedings
Papers in SenSys's main DBLP volume each year, not official acceptance counts.
Papers in 2025
116
main DBLP volume
5-year change
-28%
vs 2020
Papers, all years
2,046
24 years since 2003
Authors per paper
4.9
4.7 in 2015
By an entirely new team
22%
of 2025 papers
Papers per year2003 to 2025
Top keywords, 2025
sensingiotmmwaveedgeradarenvironmentaltomographymmwave radarc-v2x direct communicationdynamism and efficiencyedge aifriction sensing
Venues like SenSys
- UbiComp/ISWC ACM International Joint Conference on Pervasive and Ubiquitous Computing0.39sensingmmwaveradarsensors
- MobiCom ACM Annual International Conference On Mobile Computing And Networking0.37sensingmmwaveloraiot
- MobiSys ACM International Conference on Mobile Systems, Applications, and Services0.32mmwavesensingacousticbackscatter
- SECON IEEE International Conference on Sensing, Communication, and Networking0.29mmwavesensingradarmmwave radar
Most published at SenSys
- Tian He2003 to 202538
- John A. Stankovic2003 to 202036
- Prabal Dutta2006 to 202536
- Mani B. Srivastava2003 to 202233
- Wen Hu2005 to 202629
Who publishes here
2025 to 2026 · papers count once per institution on them
Academia 95%Industry 0%Government and other 5%
Institutions
- 1Nanyang Technological University🇸🇬14
- 2University of California San Diego🇺🇸13
- 3Hong Kong University of Science and Technology🇭🇰12
- 4University of California, Los Angeles🇺🇸10
- 5University of Massachusetts Amherst🇺🇸10
- 6Shanghai Jiao Tong University🇨🇳8
- 7University of Michigan🇺🇸7
- 8Carnegie Mellon University🇺🇸7
Countries
- United States125
- China53
- Hong Kong SAR China24
- Singapore20
- United Kingdom10
- Australia9
Affiliations from OpenAlex for the papers DBLP lists. A paper with authors from three institutions counts for each of them; the split above is over the top institutions.